Rapid increase in heating by unit area due to lightweight, thin, small-size and high-integration trends in electronic goods; decrease in product life and reliability consequently
Increase in the heat-dissipation issue due to the wide spread and high output of high-voltage LED chips; 57% in life expectancy and increase in efficiency by 14% when LED temperature drops by 10°C
Small size in electric
& electronic goods
Lightweight
Highly functional
Fully dense parts
Highly integrated
Serious heating issue
Rising demand for polymeric
composite materials
A thin honeycomb-structured layer of 2-dimensional planar carbon atoms in SP2-hybridized configuration; as thin as 0.2nm (size of an atom) and both physically and chemically safe
| Category | Descriptions |
|
|---|---|---|
| Electrical Conductivity | 100 times greater than copper (Cu) | |
| Electronic Mobility | 100 times greater than semiconductor silicone | |
| Strength | 200 times greater than steel | |
| Thermal Conductivity | Twice as high as diamond (approx. 5300W / m•K) | |
| Transmittance | Light mostly transmitted; transparent and properties unchanged (97.7%@450nm) | |
| Stretchability | Hexagonal net-shaped; stretchable up to 20% of its own area |
Image of heat release inside the thermal interface material
Adhesion between materials; able to absorb shock up to ‘shore 00’
An excellent insulator even under high voltage; transformed into silica, an insulating substance after combustion
Hydrophobic with 21 dyn/cm in surface tension
Flame retardant; no toxic gas production without halogen elements
150-250℃ operating temperature range; up to 350℃ if used for a short time intermittently
Able to maintain elasticity and resilience over a broad temperature range (-30℃ - 250℃)
Heat-related plastic injection products such as an engine cover
LED headlamp housing, heat-dissipation structure
Heat-dissipation structures including bottom chassis, housing, frame and SMPS heat sink
LED lamp heat-dissipation structure, housing, organ
Thermal Interface Materials(TIM)
